DIV 27 · COMMUNICATIONSCOMMUNICATIONSCUT SHEET INDEXED

PanduitMini-Com® Modular Patch Panels with FaceplatesOTSP29--WW-ENG

Panduit Modular Patch Panel (Structured Cabling). Model OTSP29--WW-ENG. Front-releasable molded snap-in faceplates; Accepts all Panduit Mini-Com Modules for mixed media; Available in standard and high-density configurations; Angled and recessed designs available for cable management. material: CRS stamping, ABS faceplate

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PDFOTSP29--WW-ENG.pdfData sheet
Panduit OTSP29--WW-ENG cut sheet — first page
Official manufacturer data sheetOpen PDF ↗
Manufacturer
Panduit
Catalog no.
OTSP29--WW-ENG
Product type
Communications
MasterFormat
27
Cut sheet
PDF · manufacturer current

Product details

Catalog numberOTSP29--WW-ENG
DescriptionPanduit Modular Patch Panel (Structured Cabling). Model OTSP29--WW-ENG. Front-releasable molded snap-in faceplates; Accepts all Panduit Mini-Com Modules for mixed media; Available in standard and high-density configurations; Angled and recessed designs available for cable management. material: CRS stamping, ABS faceplate
Connection size24-port, 48-port, 72-port
End connectionMini-Com Modules (UTP, STP, fiber, A/V)
MountingStandard 19" or 23" EIA racks
Dimensions1 RU (24-port), 2 RU (48/72-port).
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